DocumentCode :
2623198
Title :
Thermal runaway characteristics of silicon microstrip module designed for ATLAS upgrade inner tracker at super LHC
Author :
Kohriki, T. ; Terada, S. ; Unno, Y. ; Ikegami, Y. ; Hara, K.
Author_Institution :
Inst. of Particle and Nuclear Studies, High Energy Accelerator Research Org., KEK, Tsukuba, Ibaraki 305-0801 Japan
fYear :
2008
fDate :
19-25 Oct. 2008
Firstpage :
2211
Lastpage :
2214
Abstract :
In accordance with the super LHC program, which plans to increase a collision rate of LHC by tenfold, the ATLAS silicon strip trackers need to be upgraded to overcome proportionally higher data rate and harsher radiation environment. Immediate concern is an increase of leakage current induced by radiation damage under such a severe condition. Without proper thermal management increase of the leakage current might lead silicon tracker modules to a catastrophic thermal runaway. Considering that the ATLAS inner trackers are strictly required to be as thin as possible in radiation length, careful optimization is imperative to cope with a robust thermal performance against thermal runaway. Based on the present ATLAS silicon strip modules (SCT), we have designed an upgrade silicon module, which consists of large area silicon sensors with short readout strips and densely populated readout ASIC’s. Thermal performance of such a module is investigated employing three dimensional FEA thermal analyses as well as a prototype thermal module. Although the upgrade module is about five times denser in readout channels than the present SCT, it shows a good thermal performance even with module materials comparable to the present SCT.
Keywords :
Large Hadron Collider; Leakage current; Microstrip; Robustness; Silicon; Strips; Temperature dependence; Temperature sensors; Thermal management; Thermal sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nuclear Science Symposium Conference Record, 2008. NSS '08. IEEE
Conference_Location :
Dresden, Germany
ISSN :
1095-7863
Print_ISBN :
978-1-4244-2714-7
Electronic_ISBN :
1095-7863
Type :
conf
DOI :
10.1109/NSSMIC.2008.4774791
Filename :
4774791
Link To Document :
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