DocumentCode
2623269
Title
Printed circuit boards post-layout analysis: from signal integrity to radiated emissions
Author
Caniggia, S. ; Costa, V. ; Meani, C. ; Preatoni, R.
Author_Institution
Italtel Soc. Italiana Telecommun. SpA, Milan, Italy
Volume
2
fYear
1998
fDate
24-28 Aug 1998
Firstpage
975
Abstract
A test PCB, called SQ-test, reproducing actual high speed digital signal distributions, was designed and realized to investigate signal integrity problems such as crosstalk in multi conductor transmission lines (TLs) with nonlinear loads. The same PCB was also used to study radiated emissions from traces modeled as TLs and integrated circuits (ICs) modeled as small loops. It is shown that distributed TL models are appropriate for interconnections with linear loads but not sufficient to simulate structures with many loads and several gates switching simultaneousiy in the same chip of the IC
Keywords
crosstalk; electromagnetic interference; integrated circuit interconnections; printed circuit testing; transmission line theory; ICs; PCB post-layout analysis; SQ-test; crosstalk; distributed transmission line models; gate switching; high speed digital signal distributions; integrated circuits; multi conductor transmission lines; nonlinear loads; printed circuit boards; radiated emissions; signal integrity; test PCB; Circuit analysis; Circuit testing; Conductors; Crosstalk; Distributed parameter circuits; Integrated circuit interconnections; Integrated circuit modeling; Printed circuits; Signal analysis; Signal design;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 1998. 1998 IEEE International Symposium on
Conference_Location
Denver, CO
Print_ISBN
0-7803-5015-4
Type
conf
DOI
10.1109/ISEMC.1998.750340
Filename
750340
Link To Document