• DocumentCode
    262403
  • Title

    20.6 A blocker-resilient wideband receiver with low-noise active two-point cancellation of >0dBm TX leakage and TX noise in RX band for FDD/Co-existence

  • Author

    Jin Zhou ; Kinget, Peter R. ; Krishnaswamy, Harish

  • Author_Institution
    Columbia Univ., New York, NY, USA
  • fYear
    2014
  • fDate
    9-13 Feb. 2014
  • Firstpage
    352
  • Lastpage
    353
  • Abstract
    The demand for lower cost and form factor and increased re-configurability in wireless systems has driven the investigation of blocker-tolerant software-defined radios [1-4]. While promising, a reduction in system form-factor will result in lower isolation among antennas due to the co-existence of multiple ratios or lower isolation within duplexers for FDD systems due to their reduced size and/or increased re-configurability. Out-of-band (OOB) powerful modulated TX-leakage due to limited antenna/duplexer isolation imposes challenges that are more severe than those posed by continuous-wave (CW) blockers by several orders of magnitude, including cross-modulation, second-order intermodulation and TX noise in the RX band (Fig. 20.6.1). Analysis shows that in the face of 0dBm peak TX leakage and a -30dBm CW in-band jammer, to achieve -90dBm sensitivity with 7dB SNR over 2MHz signal BW, a transceiver must exhibit +30dBm receiver OOB IIP3 and -160dBc/Hz TX noise in RX band.
  • Keywords
    antennas; frequency division multiplexing; intermodulation; radio receivers; software radio; CW blockers; CW in-band jammer; FDD-coexistence system; RX band; TX noise; antennas; blocker-resilient wideband receiver; blocker-tolerant software-defined radios; continuous-wave blockers; cross-modulation; duplexer isolation; low-noise active two-point cancellation; out-of-band powerful modulated TX-leakage; receiver OOB IIP3; second-order intermodulation; system form-factor reduction; transceiver; wireless systems; Baseband; Linearity; Noise; Noise measurement; Receivers; Solid state circuits; Wideband;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4799-0918-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.2014.6757466
  • Filename
    6757466