• DocumentCode
    262406
  • Title

    20.7 A multi-band inductor-less SAW-less 2G/3G-TD-SCDMA cellular receiver in 40nm CMOS

  • Author

    Ming-Da Tsai ; Chih-Fan Liao ; Chi-Yun Wang ; Yi-Bin Lee ; Tzeng, Bosen ; Guang-Kaai Dehng

  • Author_Institution
    MediaTek, Hsinchu, Taiwan
  • fYear
    2014
  • fDate
    9-13 Feb. 2014
  • Firstpage
    354
  • Lastpage
    355
  • Abstract
    The growing demand for high-speed wireless communication has driven the evolution of cellular phone networks. New-generation cellular standards use wider channel bandwidth and more sophisticated modulation to obtain higher data-rates. Due to various cellular standards, chip providers are required to offer highly integrated solutions that support 2G, 3G, and even 4G in one chip. This paper presents a receiver supporting 2G quad bands and 3G TD-SCDMA dual bands. Figure 20.7.1 shows the 2G/3G receiver, whose front-end current-mode outputs are combined at baseband CR filter and biquad PGA, which are shared between all bands. A dynamic gain-bandwidth-product-extension circuit technique is used to remove a transimpedance amplifier to save die area and current.
  • Keywords
    3G mobile communication; CMOS integrated circuits; cellular radio; channel allocation; code division multiple access; inductors; integrated circuit packaging; next generation networks; operational amplifiers; surface acoustic waves; telecommunication standards; 3G TD-SCDMA dual bands; 4G; CMOS; PGA; baseband CR filter; cellular phone networks; cellular standards; dynamic gain-bandwidth-product-extension circuit; high-speed wireless communication; multiband inductor less SAW-less 2G/3G-TD-SCDMA cellular receiver; receiver supporting 2G quad bands; size 40 nm; transimpedance amplifier; wider channel bandwidth; Bandwidth; Linearity; Noise measurement; Receivers; Spread spectrum communication; Time division synchronous code division multiple access;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4799-0918-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.2014.6757467
  • Filename
    6757467