Microstrip Transmission on Semiconductor Dielectrics

As a result of both a larger number of microwave functions performed by semiconductor devices and a larger number of functions required in modern systems, it has become highly desirable from both the system and the device standpoint, to fabricate multiple microwave semiconductor devices on a common substrate. The use of multiple devices in a single package has system and reliability advantages, but there is also offered the possibility of improved performance of the microwave components. This results from the elimination of packaging of each individual element and the abillty to pIace the package interface in a more advantageous position in the circuit.