DocumentCode :
262433
Title :
22.2 A 69.5mW 20GS/s 6b time-interleaved ADC with embedded time-to-digital calibration in 32nm CMOS SOI
Author :
Chen, Vanessa H.-C ; Pileggi, Larry
Author_Institution :
Carnegie Mellon Univ., Pittsburgh, PA, USA
fYear :
2014
fDate :
9-13 Feb. 2014
Firstpage :
380
Lastpage :
381
Abstract :
Low-power time-interleaved ADCs with high sampling rates of over 10GS/s are in high demand for wireline communication systems. However, the time-interleaved channels suffer from process mismatch, particularly for timing skew. Although a power-consuming two-rank track-and-hold (T/H) can prevent such timing-skew problems, distributed T/Hs can be used for lower-power operation with timing-skew calibration to meet the skew specifications of 200fsrms for 6b resolution and 10GHz input signals. Instead of using software calibration with Fourier analysis [1-3], requiring a special input reference signal [4], or relying on the statistics of the input signal [5], this work presents a low-complexity on-chip background calibration technique to reduce gain, offset, and delay mismatches between channels. This enables small-size transistors to be used in comparators and clock delivery circuits to avoid serious noise coupling and save considerable power for such an ultra-high-speed system. The presented 8-way time-interleaved 20GS/s 6b ADC achieves an SNDR of 30.7dB at Nyquist and consumes only 69.5mW.
Keywords :
CMOS integrated circuits; Fourier analysis; analogue-digital conversion; low-power electronics; silicon-on-insulator; CMOS; Fourier analysis; Nyquist; SNDR; SOI; frequency 10 GHz; low-complexity on-chip background calibration technique; low-power time-interleaved ADC; power 69.5 mW; power-consuming two-rank track-and-hold; process mismatch; size 32 nm; small-size transistors; software calibration; time-interleaved channels; time-to-digital calibration; ultra-high-speed system; wireline communication systems; CMOS integrated circuits; Calibration; Clocks; Delays; Frequency measurement; Jitter;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0193-6530
Print_ISBN :
978-1-4799-0918-6
Type :
conf
DOI :
10.1109/ISSCC.2014.6757478
Filename :
6757478
Link To Document :
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