• DocumentCode
    262471
  • Title

    24.3 An implantable 64nW ECG-monitoring mixed-signal SoC for arrhythmia diagnosis

  • Author

    Dongsuk Jeon ; Yen-Po Chen ; Yoonmyung Lee ; Yejoong Kim ; Zhiyoong Foo ; Kruger, Grant ; Oral, Hakan ; Berenfeld, Omer ; Zhengya Zhang ; Blaauw, D. ; Sylvester, Dennis

  • Author_Institution
    Univ. of Michigan, Ann Arbor, MI, USA
  • fYear
    2014
  • fDate
    9-13 Feb. 2014
  • Firstpage
    416
  • Lastpage
    417
  • Abstract
    Electrocardiography (ECG) is a critical source of information for a number of heart disorders. In arrhythmia studies and treatment, long-term observation is critical to determine the nature of the abnormality and its severity. However, even small body-wearable systems can impact a patient´s everyday life and signals captured using such systems are prone to noise from sources such as 60Hz power and body movement. In contrast, implanted devices are less susceptible to these noise sources and, while having closer-spaced electrodes, can obtain similar quality ECG signals due to their proximity to the heart [1]. In addition, implanted devices enable continuous monitoring without affecting patient quality of life. As in other implantable systems, low power consumption is a critical factor; in this case to provide a sufficiently long operating time between wireless recharge events.
  • Keywords
    bioelectric potentials; biomedical electrodes; body sensor networks; diseases; electrocardiography; medical disorders; medical signal detection; medical signal processing; patient monitoring; arrhythmia diagnosis; arrhythmia treatment; body movement; body-wearable systems; electrocardiography; electrodes; frequency 60 Hz; heart disorders; implantable ECG-monitoring mixed-signal SoC; low power consumption; noise sources; power 64 nW; Batteries; Electrocardiography; Monitoring; Noise; Power demand; System-on-chip; Wireless communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4799-0918-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.2014.6757494
  • Filename
    6757494