Title :
Thermal analysis for temperature robust wireless power transfer systems
Author :
Kiwon Hwang ; Sanghoon Chung ; Uooyeol Yoon ; Manho Lee ; Seungyoung Ahn
Author_Institution :
Cho Chun Shik Grad. Sch. for Green Transp., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea
Abstract :
This paper reports thermal analysis of a 35kW wireless power transfer (WPT) pickup module to keep the system´s efficiency at different temperatures. Temperature effects are first considered by looking at change in efficiency of the system which is influenced by change in resistance and capacitance at different temperatures. Then, we introduce methods to improve the overall performance of a high powered WPT system by utilizing appropriate wires and capacitors, and cooling the device by means of an optimized heat sink.
Keywords :
capacitance; capacitors; cooling; electric resistance; heat sinks; optimisation; radiofrequency power transmission; thermal analysis; wires (electric); WPT system; capacitance; capacitor; device cooling; heat sink optimisation; pickup module; power 35 kW; resistance; temperature effect; thermal analysis; wire; wireless power transfer system; Capacitance; Capacitors; Heat sinks; Resistance; Resonant frequency; Temperature dependence; Wireless communication; Capacitance; Efficiency; Heat sink; Optimization; Resistance; Resonance frequency; Thermal analysis; Wireless Power Transfer (WPT);
Conference_Titel :
Wireless Power Transfer (WPT), 2013 IEEE
Conference_Location :
Perugia
Print_ISBN :
978--14673-5008-2
DOI :
10.1109/WPT.2013.6556879
