• DocumentCode
    262501
  • Title

    26.2 A 205mW 32Gb/s 3-Tap FFE/6-tap DFE bidirectional serial link in 22nm CMOS

  • Author

    Jaussi, James ; Balamurugan, Ganesh ; Hyvonen, Sami ; Tzu-Chien Hsueh ; Musah, Tawfiq ; Keskin, Gokce ; Shekhar, Shashi ; Kennedy, Jessie ; Sen, Satyaki ; Inti, Rajesh ; Mansuri, Mozhgan ; Leddige, Michael ; Horine, Bryce ; Roberts, Clive ; Mooney, Randy

  • Author_Institution
    Intel, Hillsboro, OR, USA
  • fYear
    2014
  • fDate
    9-13 Feb. 2014
  • Firstpage
    440
  • Lastpage
    441
  • Abstract
    Peripheral I/O data-rates for PCs and mobile computing platforms continue to scale to meet high-bandwidth applications including high-resolution displays and large-capacity external storage. The bandwidth requirements will soon exceed the data-rates of current standards such as PCI Express and USB. A low-power low-cost serial link is needed for the next-generation peripheral interface that can scale to 32Gb/s per lane. Recent publications have demonstrated 28 to 32Gb/s rates [1-2]. However, the circuit power and channel characteristics are not suitable for mainstream PC and mobile markets. A low-profile connector and cable assembly prototype is developed for these markets, where the link architecture and design are optimized for the channel characteristics. This paper describes a data-rate-scalable 32Gb/s serial link that features a bidirectional transceiver, source-series terminated (SST) 3-tap FFE, a continuous-time linear equalizer (CTLE) with an active inductor, a 6-tap DFE, and clock calibration and adaptation circuitry.
  • Keywords
    CMOS digital integrated circuits; peripheral interfaces; transceivers; 6-tap DFE; CMOS; PCI Express; USB; active inductor; adaptation circuitry; bidirectional serial link; bidirectional transceiver; bit rate 28 Gbit/s to 32 Gbit/s; channel characteristics; circuit power; clock calibration; continuous-time linear equalizer; high-resolution displays; large-capacity external storage; low-profile connector; mobile computing platforms; mobile markets; peripheral I/O data-rates; peripheral interface; power 205 mW; size 22 nm; source-series terminated 3-tap FFE; Assembly; CMOS integrated circuits; Clocks; Decision feedback equalizers; Latches; Phase locked loops; Transceivers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4799-0918-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.2014.6757504
  • Filename
    6757504