DocumentCode :
2625187
Title :
Stress Memorization Technique (SMT) Optimization for 45nm CMOS
Author :
Ortolland, C. ; Morin, P. ; Chaton, C. ; Mastromatteo, E. ; Populaire, C. ; Orain, S. ; Leverd, F. ; Stolk, P. ; Boeuf, F. ; Arnaud, F.
Author_Institution :
Philips Semicond., Crolles
fYear :
0
fDate :
0-0 0
Firstpage :
78
Lastpage :
79
Abstract :
In this paper, we present an optimization path of stress memorization technique (SMT) for 45nm node and below using a nitride capping layer. We demonstrate that the understanding of coupling between nitride properties, dopant activation and poly-silicon gate mechanical stress allows enhancing nMOS performance by 7% without pMOS degradation. In contrast to previously reported works on SMT (Chen et al., 2004) - (Singh et al., 2005), a low-cost process compatible with consumer electronics requirements has been successfully developed
Keywords :
CMOS integrated circuits; plasma materials processing; semiconductor doping; stress analysis; 45 nm; CMOS; dopant activation; nMOS; nitride capping layer; nitride properties; pMOS; poly-silicon gate mechanical stress; stress memorization; Capacitance; Circuits; Consumer electronics; Degradation; Hydrogen; MOS devices; Mechanical factors; Silicon compounds; Stress; Surface-mount technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 2006. Digest of Technical Papers. 2006 Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
1-4244-0005-8
Type :
conf
DOI :
10.1109/VLSIT.2006.1705225
Filename :
1705225
Link To Document :
بازگشت