• DocumentCode
    262535
  • Title

    27.7 A scalable 1.5-to-6Gb/s 6.2-to-38.1mW LDPC decoder for 60GHz wireless networks in 28nm UTBB FDSOI

  • Author

    Weiner, M. ; Blagojevic, Marjan ; Skotnikov, Sergey ; Burg, Andreas ; Flatresse, Philippe ; Nikolic, B.

  • Author_Institution
    Univ. of California, Berkeley, Berkeley, CA, USA
  • fYear
    2014
  • fDate
    9-13 Feb. 2014
  • Firstpage
    464
  • Lastpage
    465
  • Abstract
    Low-density parity-check (LDPC) codes in modern wireless communications are rate- and throughput-scalable, and despite their complexity, decoding them requires low power consumption. The IEEE 802.11ad standard for Gb/s wireless LANs in the 60GHz band requires an implementation of an LDPC encoder/decoder with throughputs of 1.5, 3, and 6Gb/s, with code rates of 1/2, 5/8, 3/4 and 13/16. Previous implementations of decoders for these throughputs and levels of reconfiguration have power consumptions on the order of the rest of the baseband processing. This paper presents a fully compatible IEEE 802.11ad LDPC decoder in 28 nm ultra-thin body and BOX fully-depleted SOI (UTBB FDSOI) technology with a power consumption that is a small fraction of the total baseband power. To achieve this, the decoder introduces an approximate marginalization technique and a simplified reconfiguration method. Forward body biasing of FDSOI technology allows for minimum energy consumption across all decoding modes.
  • Keywords
    buried layers; codecs; field effect MIMIC; low-power electronics; parity check codes; silicon-on-insulator; wireless LAN; BOX fully depleted SOI technology; IEEE 802.11ad standard; LDPC decoder; LDPC encoder; UTBB FDSOI; approximate marginalization technique; forward body biasing; frequency 60 GHz; low density parity check codes; minimum energy consumption; power 6.2 mW to 38.1 mW; reconfiguration method; size 28 nm; ultrathin body SOI technology; wireless networks; Bit error rate; Decoding; Parity check codes; Pipeline processing; Power demand; Solid state circuits; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4799-0918-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.2014.6757515
  • Filename
    6757515