DocumentCode
262636
Title
Session 10 overview: Mobile Systems-on-Chip (SoCs): Energy-efficient digital subcommittee
Author
Erraguntla, Vasantha ; Hashimoto, Takashi
Author_Institution
Intel, Bangalore, India
fYear
2014
fDate
9-13 Feb. 2014
Firstpage
174
Lastpage
175
Abstract
Mobile SoCs are becoming extremely complex to meet the relentless demand for more compute power and a richer user experience in mobile applications. Qualcomm´s Hexagon DSP in 28nm CMOS consumes 58mW/MHz at 0.6V, while Renesas and MediaTek present multicore heterogeneous processors with low power to achieve long battery life and boost performance by exploiting thermal headroom. A multicore processor from KAIST delivers a rich user experience with a 30fps 720p augmented reality chip for wearable electronics. To minimize standby-power, NEC introduces a 16b MTJ-based non-volatile microcontroller with low wakeup time among NV SoCs. Additionally, power-efficient digital baseband SoCs from imec, the Technical University of Dresden and Ericsson are presented, which support multi-standard communication at low power using fine-grain power management techniques.
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
Conference_Location
San Francisco, CA, USA
ISSN
0193-6530
Print_ISBN
978-1-4799-0918-6
Type
conf
DOI
10.1109/ISSCC.2014.6757556
Filename
6757556
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