• DocumentCode
    262636
  • Title

    Session 10 overview: Mobile Systems-on-Chip (SoCs): Energy-efficient digital subcommittee

  • Author

    Erraguntla, Vasantha ; Hashimoto, Takashi

  • Author_Institution
    Intel, Bangalore, India
  • fYear
    2014
  • fDate
    9-13 Feb. 2014
  • Firstpage
    174
  • Lastpage
    175
  • Abstract
    Mobile SoCs are becoming extremely complex to meet the relentless demand for more compute power and a richer user experience in mobile applications. Qualcomm´s Hexagon DSP in 28nm CMOS consumes 58mW/MHz at 0.6V, while Renesas and MediaTek present multicore heterogeneous processors with low power to achieve long battery life and boost performance by exploiting thermal headroom. A multicore processor from KAIST delivers a rich user experience with a 30fps 720p augmented reality chip for wearable electronics. To minimize standby-power, NEC introduces a 16b MTJ-based non-volatile microcontroller with low wakeup time among NV SoCs. Additionally, power-efficient digital baseband SoCs from imec, the Technical University of Dresden and Ericsson are presented, which support multi-standard communication at low power using fine-grain power management techniques.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4799-0918-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.2014.6757556
  • Filename
    6757556