Session 30 overview: Technologies for next-generation systems: Technology directions subcommittee

New materials and technologies are enabling next generation systems and applications. The first four papers in this session combine different semiconductor materials (organic and/or oxide) on flexible foils to realize a variety of applications such as a microprocessor, a display, a sensor and an RFID tag. Papers 5, 8 and 9 combine in a hybrid manner crystalline high-bandgap semiconductors on top of the back-end-of-line (BEOL) of silicon. In papers 6 and 7 dedicated communication systems are implemented in automobiles and over the human body. Finally, paper 10 implements a learning machine mimicking the activity in the human brain.