DocumentCode

2627105

Title

Integrating Chip Carrier Packaging Technology Into Avionic Systems

Author

Bones, E.C. ; Chappell, C.D.

Author_Institution

Sperry Corporation

fYear

1998

fDate

17-17 July 1998

Firstpage

271

Lastpage

278

Keywords

Aerospace electronics; Automatic testing; Electric shock; Humidity; Packaging; Power system reliability; Sea surface; Soldering; Surface-mount technology; System testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Aerospace and Electronics Conference, 1998. NAECON 1998. Proceedings of the IEEE 1998 National

Conference_Location

Dayton, OH, USA

ISSN

0547-3578

Print_ISBN

0-7803-4449-9

Type

conf

DOI

10.1109/NAECON.1998.710127

Filename

710127