• DocumentCode
    2627203
  • Title

    Design and application of high-temperature-withstanding high pressure transducer

  • Author

    Yuan, Eao-hui ; Yuan, Tian-You ; Da Cao

  • Author_Institution
    Xian Modern Chem. Res. Inst., China
  • Volume
    2
  • fYear
    1997
  • fDate
    19-21 May 1997
  • Firstpage
    819
  • Abstract
    A new type of high temperature withstanding high pressure transducer is described. The transducer uses Manganin wire as sensing-element and can measure pressure up to 250 MPa under condition of high temperature up to 200°C for a long time. The expanded uncertainty in measurement of the transducer is less than 1.0% verified by calibration and practical use. This paper discusses the key technology issues, such as high pressure sealing and linearity correction under the temperature range from 0°C to 200°C, etc. The calibration test under high temperature condition is carried out against a free piston gauge having an uncertainty of 0.1%. Measured results in practical use on high-pressure cauldrons for growing man-made crystals are given
  • Keywords
    calibration; compensation; electric sensing devices; furnaces; high-pressure techniques; high-temperature techniques; pressure control; pressure transducers; process control; seals (stoppers); 0 to 200 C; 250 MPa; Manganin wire; calibration; calibration test; crystal growth furnaces; expanded uncertainty; free piston gauge; high pressure sealing; high pressure transducer; high-pressure cauldrons; high-temperature-withstanding; lead wire soldering; linearity correction; nonlinearities compensation; pressure control; pressure transfer media; process control; transducer design; wire resistance change; Calibration; Linearity; Measurement uncertainty; Pressure measurement; Temperature distribution; Temperature sensors; Testing; Time measurement; Transducers; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference, 1997. IMTC/97. Proceedings. Sensing, Processing, Networking., IEEE
  • Conference_Location
    Ottawa, Ont.
  • ISSN
    1091-5281
  • Print_ISBN
    0-7803-3747-6
  • Type

    conf

  • DOI
    10.1109/IMTC.1997.610190
  • Filename
    610190