Printed Circuit Board vibration analysis using simplified finite element models

Author

Burmitskih, Anton V. ; Lebedev, Aleksandr P. ; Levitskiy, Alexey A. ; Moskovskih, Mikhail S.

Author_Institution

Siberian Fed. Univ., Krasnoyarsk, Russia

fYear

2013

fDate

12-13 Sept. 2013

Firstpage

1

Lastpage

4

Abstract

Vibration and shock loadings can lead to an operating mode violation of the electronic equipment, Printed Circuit Board (PCB) and electronic components failure. A major difficulty with PCB vibration response prediction is caused by influence of electronic components, as the components effectively increase the mass and stiffness of the PCB. The problem can be solved by using simplified method based on addition the mass and stiffness of the components to the PCB model. This work developed a methodology of PCB vibration analysis using simplified finite element models.

Keywords

failure analysis; finite element analysis; printed circuits; PCB vibration analysis; electronic component failure; electronic equipment; printed circuit board; shock loadings; simplified finite element models; vibration loadings; Analytical models; Finite element analysis; Integrated circuit modeling; Iron; Load modeling; Numerical models; Vibrations; BGA; printed circuit board (PCB) vibrations; testing; vibration; vibration endurance;

fLanguage

English

Publisher

ieee

Conference_Titel

Control and Communications (SIBCON), 2013 International Siberian Conference on

Conference_Location

Krasnoyarsk

Print_ISBN

978-1-4799-1060-1

Type

conf

DOI

10.1109/SIBCON.2013.6693570

Filename

6693570