DocumentCode :
2627883
Title :
Efficient evaluation of the frequency-dependent impedance matrix of full-package structures
Author :
Chiariello, A.G. ; Girardi, A. ; Iorio, C. ; Izzi, R. ; Lessio, T. ; Maffucci, A. ; Ventre, S.
Author_Institution :
DIEL, Univ. di Napoli Federico II, Naples, Italy
fYear :
2010
fDate :
9-12 May 2010
Firstpage :
127
Lastpage :
130
Abstract :
The paper deals with the problem of the efficient extraction of the impedance matrix for a complex full-package structure. This result applies to ranges from DC to frequencies for which the skin effect is pronounced but the radiation and other full-wave effects are still negligible. The model identifies the impedance matrix by enforcing a physically consistent behavior to the resistance and reactance of the package in the low and high frequency limits. The identification is made by using only 5 frequency samples of the impedance matrix, which could be either given by measurements or numerical simulations. In this paper we have used a commercial 3D electromagnetic code (FastHenry) to provide the 5 starting points and the reference values to validate the procedure. Benchmark tests and case-studies are carried out, confirming the accuracy of the model.
Keywords :
electronics packaging; matrix algebra; numerical analysis; FastHenry; commercial 3D electromagnetic code; frequency-dependent impedance matrix; full-package structures; numerical simulations; skin effect; Conductors; Crosstalk; Frequency; Impedance; Inductance; Integral equations; Integrated circuit modeling; Packaging; Proximity effect; Skin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects (SPI), 2010 IEEE 14th Workshop on
Conference_Location :
Hildesheim
Print_ISBN :
978-1-4244-7611-4
Type :
conf
DOI :
10.1109/SPI.2010.5483551
Filename :
5483551
Link To Document :
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