• DocumentCode
    2627883
  • Title

    Efficient evaluation of the frequency-dependent impedance matrix of full-package structures

  • Author

    Chiariello, A.G. ; Girardi, A. ; Iorio, C. ; Izzi, R. ; Lessio, T. ; Maffucci, A. ; Ventre, S.

  • Author_Institution
    DIEL, Univ. di Napoli Federico II, Naples, Italy
  • fYear
    2010
  • fDate
    9-12 May 2010
  • Firstpage
    127
  • Lastpage
    130
  • Abstract
    The paper deals with the problem of the efficient extraction of the impedance matrix for a complex full-package structure. This result applies to ranges from DC to frequencies for which the skin effect is pronounced but the radiation and other full-wave effects are still negligible. The model identifies the impedance matrix by enforcing a physically consistent behavior to the resistance and reactance of the package in the low and high frequency limits. The identification is made by using only 5 frequency samples of the impedance matrix, which could be either given by measurements or numerical simulations. In this paper we have used a commercial 3D electromagnetic code (FastHenry) to provide the 5 starting points and the reference values to validate the procedure. Benchmark tests and case-studies are carried out, confirming the accuracy of the model.
  • Keywords
    electronics packaging; matrix algebra; numerical analysis; FastHenry; commercial 3D electromagnetic code; frequency-dependent impedance matrix; full-package structures; numerical simulations; skin effect; Conductors; Crosstalk; Frequency; Impedance; Inductance; Integral equations; Integrated circuit modeling; Packaging; Proximity effect; Skin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects (SPI), 2010 IEEE 14th Workshop on
  • Conference_Location
    Hildesheim
  • Print_ISBN
    978-1-4244-7611-4
  • Type

    conf

  • DOI
    10.1109/SPI.2010.5483551
  • Filename
    5483551