Title :
Virtual-EMI lab: Removing mysteries from black-magic to a successful front-end design
Author :
Fahmy, Hany ; Wang, Chen ; Pissoort, Davy ; Badesha, Amolak
Author_Institution :
Nvidia Corp., Santa Clara, CA, USA
Abstract :
EMI engineers are struggling everyday with complex radiation problems that fail critical products to pass EMI certification and causes big loss of profit. Advances in EMI engineering are following a similar trend like Signal-Integrity engineering 10-years ago when simulation tools became capable of providing accurate predictive simulations in a reasonable amount of time. With careful engineering utilizing cutting-edge full-wave field-solver software: Momentum (MOM), EMpro (FDTD) along with a hardware boost with heterogeneous massive CPU/GPU parallel processing (CUDA) technology, we can move the EMI teams from the back-end black-magic to a successful cost-effective front-end design. This paper presents an innovative process (Virtual-EMI lab) for pre- and post-tape-out providing the designers with an early stage EMI-suppression matrix (on-chip and onboard enablers) to find the optimum trade-off between performance and cost.
Keywords :
certification; computer graphic equipment; electrical engineering computing; electromagnetic interference; interference suppression; laboratories; parallel processing; software tools; virtual reality; CUDA technology; EMI certification; EMI suppression matrix; EMpro software; FDTD; GPU parallel processing technology; Momentum software; cost-effective front-end design; cutting-edge full-wave field-solver software; heterogeneous massive CPU technology; signal integrity engineering; virtual-EMI lab; Certification; Cost function; Design engineering; Electromagnetic interference; Finite difference methods; Hardware; Message-oriented middleware; Parallel processing; Predictive models; Time domain analysis;
Conference_Titel :
Signal Propagation on Interconnects (SPI), 2010 IEEE 14th Workshop on
Conference_Location :
Hildesheim
Print_ISBN :
978-1-4244-7611-4
DOI :
10.1109/SPI.2010.5483555