DocumentCode :
262806
Title :
A reusable BIST with software assisted repair technology for improved memory and IO debug, validation and test time
Author :
Querbach, Bruce ; Khanna, Rahul ; Blankenbeckler, David ; Yulan Zhang ; Anderson, Ronald T. ; Ellis, David G. ; Schoenborn, Zale T. ; Deyati, Sabyasachi ; Chiang, Patrick
Author_Institution :
Intel Corp., Hillsboro, OR, USA
fYear :
2014
fDate :
20-23 Oct. 2014
Firstpage :
1
Lastpage :
10
Abstract :
As silicon integration complexity increases with 3D stacking and Through-Silicon-Via (TSV), so does the occurrence of memory and IO defects and associated test and validation time. This ultimately leads to an overall cost increase. On a 14nm Intel SOC, a reusable BIST engine called Converged-Pattern-Generator-Checker (CPGC) are architected to detect memory and IO defects, and combined with the software assisted repair technology to automatically repair memory cell defects on 3D stacked Wide-IO DRAM. Additionally, we also present the CPGC gate count, power, simulation, and silicon results. The reusable CPGC IP is designed to connect to a standard IP interface, which enables a quick turn-key SOC development cycle. Silicon results show CPGC can speed up validation by 5x, improve test time from minutes down to seconds, and decrease debug time by 5x including root-cause of boot failures of the memory interface. CPGC is also used in memory training and initialization, which makes it a critical part of Intel SOC.
Keywords :
DRAM chips; built-in self test; elemental semiconductors; logic testing; silicon; system-on-chip; three-dimensional integrated circuits; 3D stacking; BIST; IO debug; Intel SOC; Si; TSV; built-in self test; converged-pattern-generator-checker; memory cell defects; size 14 nm; software assisted repair technology; through-silicon-via; wide-IO DRAM; Built-in self-test; Circuit faults; Computer architecture; IP networks; Maintenance engineering; Random access memory; Software; High speed IO; Memory Array Test Engine; Memory IO; Memory Interface Training; Post Package Repair; hardware/software calibration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference (ITC), 2014 IEEE International
Conference_Location :
Seattle, WA
Type :
conf
DOI :
10.1109/TEST.2014.7035340
Filename :
7035340
Link To Document :
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