DocumentCode :
262807
Title :
Analytical MRAM test
Author :
Robertazzi, Raphael ; Nowak, Janusz ; Sun, Jonathan
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
2014
fDate :
20-23 Oct. 2014
Firstpage :
1
Lastpage :
10
Abstract :
Magnetic Random Access Memory (MRAM) is a new technology which offers a viable alternative to other forms of nonvolatile memory, such as flash, where read access time, writing speed, and cell endurance is at a premium. Difficulties in scaling DRAM below the 32nm node may make MRAM a suitable candidate for DRAM replacement. The rigors of MRAM cell development present array designers, process engineers, and test engineers with many unique challenges. Enabling process development through test support of defect monitors makes test development particularly difficult in MRAM technology, due to the complexity of highly nonlinear magnetic materials and device behaviors. We review a number of new strategies and methodologies employed to support MRAM cell development over several MRAM generations, in a research environment. A unique test system with both advanced digital and parametric capabilities will be described. The importance of database integration within the test software and real-time data analysis will also be discussed.
Keywords :
DRAM chips; MRAM devices; circuit testing; magnetic materials; advanced digital capability; advanced parametric capability; analytical MRAM cell test development; array designers; cell endurance memory; database integration; device behavior complexity; flash memory; highly nonlinear magnetic material complexity; magnetic random access memory; monitor defects; nonvolatile memory; process engineer development; read access time memory; real-time data analysis; research environment; scaling DRAM replacement; test engineers; test software analysis; writing speed memory; Abstracts; Magnetic field measurement; Magnetic tunneling; Q measurement; Random access memory; Standards; Torque;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference (ITC), 2014 IEEE International
Conference_Location :
Seattle, WA
Type :
conf
DOI :
10.1109/TEST.2014.7035341
Filename :
7035341
Link To Document :
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