Title :
Evaluation the moisture effects on the performance of electronic devices
Author :
Khoshnaw, Fuad M.
Author_Institution :
Wolfson Sch. of Mech. & Manuf. Eng., Loughborough Univ., Loughborough, UK
Abstract :
The moisture uptake has different effects on the performance of electronic components; besides electrochemical migration, moisture affects increasing the dielectric constant of electronic substrates, i.e. multichip module, printed circuit boards and hermetic packages, consequently this cause electrical failures and signal delay. This study explains the effects of moisture and air contaminates on the performance of electronic equipments.
Keywords :
moisture; multichip modules; printed circuits; semiconductor device manufacture; semiconductor device packaging; dielectric constant; electrochemical migration; electronic components; electronic device performance; electronic substrates; hermetic packages; moisture effects; multichip module; printed circuit boards; Delay effects; Dielectric constant; Dielectric substrates; Electronic components; Electronic equipment; Electronics packaging; Moisture; Multichip modules; Packaging machines; Printed circuits;
Conference_Titel :
Signal Propagation on Interconnects (SPI), 2010 IEEE 14th Workshop on
Conference_Location :
Hildesheim
Print_ISBN :
978-1-4244-7611-4
DOI :
10.1109/SPI.2010.5483575
