DocumentCode :
262837
Title :
Counterfeit IC detection using light emission
Author :
Peilin Song ; Stellari, Franco ; Weger, Alan
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
2014
fDate :
20-23 Oct. 2014
Firstpage :
1
Lastpage :
8
Abstract :
The proliferation of counterfeit Integrated Circuits (ICs) poses a big challenge for the electronics industry as today´s supply chain of ICs becomes more complex and expensive. For this reason, it is imperative to mitigate these risks by developing counterfeit IC detection techniques, especially at the chip level. In this paper, a novel counterfeit IC detection method is proposed. It is based on the measurement of intrinsic light emission from CMOS ICs that is a strong function of the device threshold voltage (Vt) for a given technology. In contrast to currently available counterfeit IC detection techniques, the proposed method measures IC degradation after it has been used for a long time and does not require a reference IC to provide a baseline signature. A differential technique is used to detect different levels of degradation inside the same chip in order to determine if it is counterfeit. Experimental results presented in this paper show that emission can be effectively used to detect degradation, thus making this technique a very effective way to detect counterfeit ICs.
Keywords :
CMOS integrated circuits; counterfeit goods; fraud; integrated circuit manufacture; integrated circuit testing; light emitting devices; supply chain management; CMOS IC; IC degradation; baseline signature; chip level; counterfeit IC detection techniques; counterfeit integrated circuits; degradation detection; device threshold voltage; differential technique; electronics industry; intrinsic light emission measurement; risks mitigation; supply chain; Abstracts; Circuit analysis; Decision support systems; Heating; Industries; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference (ITC), 2014 IEEE International
Conference_Location :
Seattle, WA
Type :
conf
DOI :
10.1109/TEST.2014.7035356
Filename :
7035356
Link To Document :
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