• DocumentCode
    262858
  • Title

    A test probe for TSV using resonant inductive coupling

  • Author

    Rashidzadeh, Rashid ; Basith, Iftekhar Ibne

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Windsor, Windsor, ON, Canada
  • fYear
    2014
  • fDate
    20-23 Oct. 2014
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    A contactless TSV probe based on the principle of resonant inductive coupling is presented in this work. The proposed scheme allows TSV data observation up to 2Gbps when the probe and TSV are 15μm apart.
  • Keywords
    three-dimensional integrated circuits; TSV data observation; contactless TSV probe; distance 15 mum; resonant inductive coupling; test probe; Couplings; Inductors; Probes; RLC circuits; Resonant frequency; Testing; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference (ITC), 2014 IEEE International
  • Conference_Location
    Seattle, WA
  • Type

    conf

  • DOI
    10.1109/TEST.2014.7035367
  • Filename
    7035367
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=262858