• DocumentCode
    262923
  • Title

    Electrical breakdown properties of low density polyethylene under DC voltage

  • Author

    Jing Zhang ; Jian Li ; Yan Wang ; Lianwei Bao ; Xiaomeng Zhang

  • Author_Institution
    State Key Lab. of Power Transm. Equip. & Syst. Security & New Technol., Chongqing Univ., Chongqing, China
  • fYear
    2014
  • fDate
    8-11 Sept. 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The development of high voltage DC power cable is far lagging behind that of AC power cable partly due to the breakdown properties of DC cable insulation under the influence of multiple factors such as space charge and temperature. This paper presents an experimental research on electrical breakdown properties of LDPE at various temperatures to investigate the properties of DC cable insulation. A thermal aging chamber was designed for the breakdown experiment of LDPE at different levels of temperature. The breakdown experiments of LDPE were carried out and thus the influence of temperature and voltage type on the breakdown properties of LDPE was obtained. The results show that temperature has significant influence on the breakdown field strength of LDPE under DC voltage. The dispersion of breakdown field strength becomes bigger with the increase of temperature. In contrast, the influence of temperature on breakdown strength of LDPE insulation under AC voltage is relatively small.
  • Keywords
    ageing; electric breakdown; polyethylene insulation; power cable insulation; space charge; AC power cable; DC cable insulation; DC voltage; LDPE; breakdown field strength; electrical breakdown properties; high voltage DC power cable; low density polyethylene; space charge; thermal aging chamber; Breakdown voltage; Dispersion; Electric breakdown; Space charge; Temperature; Voltage measurement; Weibull distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Voltage Engineering and Application (ICHVE), 2014 International Conference on
  • Conference_Location
    Poznan
  • Type

    conf

  • DOI
    10.1109/ICHVE.2014.7035400
  • Filename
    7035400