Title :
Mechanical properties of in-situ doped polycrystalline 3C-SiC thin films
Author :
Jeong, Jae-Min ; Lee, Jong-Haw ; Chung, Gwiy-Sang
Author_Institution :
Sch. of Electr. Eng., Univ. of Ulsan, Ulsan
Abstract :
3C-SiC thin film is widely used extreme environment, RF and Bio-material in micro/nano electronic mechanical systems (M/NEMS). Mechanical properties of 3C-SiC thin films are required in the designing stage, because it is needed to accurately measuring Youngpsilas Modulus and hardness. The Youngpsilas Modulus and hardness is influenced by N-doping. In this paper, it was showed that the mechanical properties of polycrystalline (poly) 3C-SiC thin film was influenced by N-doping concentration, and 3C-SiC thin filmpsilas mechanical properties according to the N-doping concentration 1%, 3%, 5%, respectively was measured by Nano Indentation. In the case of 1% N-doping concentration, Youngldquos Modulus and Hardness were obtained as 270 GPa and 30 GPa, respectively. When the surface roughness according to N-doping concentrations was investigated by AFM (atomic force microscope), the roughness of 3C-SiC thin film doped by 5% concentration was 15 nm, which is also the best of them.
Keywords :
CVD coatings; Young´s modulus; atomic force microscopy; doping profiles; hardness; indentation; nitrogen; scanning electron microscopy; semiconductor doping; semiconductor growth; semiconductor thin films; silicon compounds; surface roughness; wide band gap semiconductors; 3C-SiC; LPCVD; RF material; SEM; SiC:N; Youngpsilas Modulus; atomic force microscope; biomaterial; hardness; in-situ doped polycrystalline thin films; nanoindentation; nitrogen doping concentration; surface roughness; thin film growth; Atomic force microscopy; Atomic measurements; Mechanical factors; Mechanical systems; Mechanical variables measurement; Nanoelectromechanical systems; Radio frequency; Rough surfaces; Surface roughness; Transistors; CVD; HMDS; poly 3C-SiC;
Conference_Titel :
Strategic Technologies, 2008. IFOST 2008. Third International Forum on
Conference_Location :
Novosibirsk-Tomsk
Print_ISBN :
978-1-4244-2319-4
Electronic_ISBN :
978-1-4244-2320-0
DOI :
10.1109/IFOST.2008.4602929