DocumentCode
2630014
Title
Influence of the packet size on the one-way delay on the down-link in 3G networks
Author
Arlos, Patrik ; Fiedler, Markus
Author_Institution
Blekinge Inst. of Technol., Karlskrona, Sweden
fYear
2010
fDate
5-7 May 2010
Firstpage
573
Lastpage
578
Abstract
The number of mobile broadband users is increasing. Furthermore, these users have high expectations into the capabilities of mobile broadband, comparable to those in fixed networks. On the other hand, the capacity assignment process on mobile access links is far from transparent to the user, and its properties need to be known in order to minimize the impact of the network on application performance. This paper investigates the impact of the packet size on the characteristics of the oneway delay for the down-link in third-generation mobile networks. For interactive and real-time applications such as VoIP, one-way delays are of major importance for user perception; however, they are challenging to measure due to their sensitivity to clock synchronization. Therefore, the paper applies a robust and innovative method to assure the quality of these measurements. We focus on the down-link as this is still the link that carries the most traffic to the user, and the quality of it will have a significant impact on all IP-based services. Results from measurements from several Swedish mobile operators reveal the possibility to partly control one-way delay and its variability by choosing appropriate packet sizes. In particular, packet sizes leading to the use of WCDMA entail significant but hardly varying one-way delays. On the other hand, we also show that HDSPA networks can deliver large amounts of data at rather high speed, but the cost is a huge variability in the one-way delay.
Keywords
Clocks; Delay; Global Positioning System; Mobile computing; Multiaccess communication; Pervasive computing; Robustness; Size control; Size measurement; Synchronization;
fLanguage
English
Publisher
ieee
Conference_Titel
Wireless Pervasive Computing (ISWPC), 2010 5th IEEE International Symposium on
Conference_Location
Modena, Italy
Print_ISBN
978-1-4244-6855-3
Electronic_ISBN
978-1-4244-6857-7
Type
conf
DOI
10.1109/ISWPC.2010.5483732
Filename
5483732
Link To Document