DocumentCode :
263017
Title :
Effect of water absorption on the dielectric properties of neat and nanosilica filled impregnating resins
Author :
Niedernhuber, J. ; Kindersberger, J.
Author_Institution :
Inst. for High Voltage Eng. & Switchgear Technol., Tech. Univ. Munchen, Munich, Germany
fYear :
2014
fDate :
8-11 Sept. 2014
Firstpage :
1
Lastpage :
4
Abstract :
Impregnating resins in high voltage machines are exposed to harsh environmental conditions characterized by high operating temperatures and high electric field. During maintenance humidity in the environment may lead to uptake of water and thus to a change of the material properties. In this study the impact of water uptake on the dielectric properties is investigated for neat epoxy- and UP-resins as well as for UP-resins with nano-scale silica fillers. Plate specimens were immersed in water at 50 °C. This leads to an uptake of moisture and thus an increase in weight. At regular intervals mass, loss tangent and relative permittivity are measured until weight as well as dielectric properties have reached steady state condition. It is shown, that the uptake of water varies with the type of polymer. Loss tangent and permittivity are rising with the content of water whereby the rise characteristic depends on the type of polymer. The effect of filler on water uptake as well as on dielectric properties is marginal.
Keywords :
absorption; machine insulation; permittivity; polymer insulators; resins; UP-resins; dielectric properties; electric field; harsh environmental conditions; high voltage machines; loss tangent; maintenance humidity; material properties; nanoscale silica fillers; nanosilica filled impregnating resins; neat epoxy-resins; operating temperatures; plate specimens; relative permittivity; steady state condition; temperature 50 C; water absorption; water uptake; Approximation methods; Dielectric losses; Generators; Lead; Materials; Signal resolution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Voltage Engineering and Application (ICHVE), 2014 International Conference on
Conference_Location :
Poznan
Type :
conf
DOI :
10.1109/ICHVE.2014.7035449
Filename :
7035449
Link To Document :
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