DocumentCode
2630506
Title
Upgraded EMC modelling of dual die structure
Author
Zhu, Boyuan ; Lu, Junwei ; Stegen, Sascha ; Li, Erping
Author_Institution
Sch. of Eng., Griffith Univ., Brisbane, QLD, Australia
fYear
2009
fDate
Aug. 16 2009-Sept. 18 2009
Firstpage
112
Lastpage
117
Abstract
Due to the variety of internal structures applied in different processors, EMC modelling should also be upgraded correspondingly. This paper presents an upgraded EMC simulation model of dual die structure which is originated from the IEEE electromagnetic challenging problem 2000-4 for conventional CPU with heatsink. The simulation results are verified by measurement with a fabricated model. Furthermore, a consequent benchmark will be provided.
Keywords
electromagnetic compatibility; heat sinks; integrated circuit packaging; microprocessor chips; CPU; EMC modelling; IEEE electromagnetic challenging problem 2000-4; dual die processor; electromagnetic measurement; heatsink; Bridge circuits; Control systems; Educational institutions; Electromagnetic compatibility; Fabrication; High power amplifiers; L-band; Microwave circuits; Power amplifiers; Transmitters; Benchmark; Dual Die; EMC; Modelling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility Symposium Adelaide, 2009.
Conference_Location
Adelaide, SA
Print_ISBN
978-1-4244-4674-2
Electronic_ISBN
978-1-4244-4675-9
Type
conf
DOI
10.1109/EMCSA.2009.5349765
Filename
5349765
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