Single-layer antireflective coating (SLARC) materials and design for GaAs
P
/Si tandem cells were analyzed by TCAD simulation. We have shown that optimum SLARC thickness is a function of bandgap, thickness, and material quality of top GaAs
subcell. Cells are analyzed for P fractions
, 0.17, 0.29, and 0.37, and ARC materials: Si
3N
4, SiO
2, ITO, HfO
2, and Al
2O
3. Optimum ARC thickness ranges from 65–75 nm for Si
3N
4 and ITO to ∼100–110 nm for SiO
2. Optimum ARC thickness increases with increasing GaAs
absorber layer thickness and with decreasing P fraction
x. Simulations show that optimum GaAs
absorber layer thickness is not a strong function of ARC material, but it increases from 250 nm for
to ∼1 μm for
and 0.37. For all P fractions, Si
3N
4, HfO
2, and Al
2O
3 performed almost equally, while SiO
2 and ITO resulted in ∼1% and ∼2% lower efficiency, respectively. Optimum SLARC thickness increases as the material quality of the top cell increases. The effect of ARC material decreases with decreasing GaAs
material quality. The maximum efficiencies are achieved for cells with ∼1-μm GaAs
0.71 P
0.29 absorber (
ns): ∼26.57% for 75-nm Si
3N
4 SLARC and 27.62% for 75-nm SiO
2/60-nm Si
3N4 double-layer ARC.