DocumentCode :
263181
Title :
Gate oxide breakdown parameter extraction with ground and power supply signature measurements
Author :
Soonyoung Cha ; Woongrae Kim ; Milor, Linda
Author_Institution :
Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2014
fDate :
26-28 Nov. 2014
Firstpage :
1
Lastpage :
6
Abstract :
Gate oxide breakdown (GOBD) is a serious reliability issue for MOS transistors. Wearout due to GOBD is traditionally modeled based on test structure data. In this paper, we present a method to determine the oxide degradation through ground and power signal signature measurements. We determine a relationship between the time-dependent ohmic resistance and the ground and power signature signal degradation and fit a model to the simulation results. Given an estimation of resistance from oxide degradation, we find the GOBD degradation model parameters. The methodology enables the extraction of GOBD model parameters for individual chips, not just for the manufacturing process, and hence it becomes possible to identify chips that are more vulnerable to GOBD.
Keywords :
MOSFET; semiconductor device models; semiconductor device reliability; GOBD degradation model parameters; GOBD model parameters extraction; MOS transistors; gate oxide breakdown; ground signal signature measurements; oxide degradation; power signal signature measurements; power supply signature measurements; reliability issue; test structure data; time-dependent ohmic resistance; wearout; Degradation; Electric breakdown; Integrated circuit modeling; Logic gates; Microprocessors; Resistance; Stress; gate oxide breakdown; oxide resistance model;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design of Circuits and Integrated Circuits (DCIS), 2014 Conference on
Conference_Location :
Madrid
Type :
conf
DOI :
10.1109/DCIS.2014.7035559
Filename :
7035559
Link To Document :
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