• DocumentCode
    2632623
  • Title

    Hierarchical exact symbolic analysis of large analog integrated circuits by symbolic stamps

  • Author

    Xu, Hui ; Shi, Guoyong ; Li, Xiaopeng

  • Author_Institution
    Sch. of Microelectron., Shanghai Jiao Tong Univ., Shanghai, China
  • fYear
    2011
  • fDate
    25-28 Jan. 2011
  • Firstpage
    19
  • Lastpage
    24
  • Abstract
    Linearized small-signal transistor models share the common circuit structure but may take different parameter values in the ac analysis of an analog circuit simulator. This property can be utilized for symbolic circuit analysis. This paper proposes to use a symbolic stamp for all device models in the same circuit for hierarchical symbolic analysis. Two levels of binary decision diagrams (BDDs) are used for maximum data sharing, one for the symbolic device stamp and the other for modified nodal analysis. The symbolic transadmittances of the device stamp share one BDD for storage saving. The modified nodal analysis (MNA) matrix formulated using symbolic stamp is of much lower dimension, hence it can be solved by a determinant decision diagram (DDD) with significantly reduced complexity. A circuit simulator is implemented based on the proposed partitioning architecture. It is able to analyze an op-amp circuit containing 44 MOS transistors exactly for the first time.
  • Keywords
    analogue integrated circuits; binary decision diagrams; matrix algebra; BDD; DDD; MNA matrix; analog circuit simulator; analog integrated circuit; binary decision diagram; determinant decision diagram; hierarchical exact symbolic analysis; linearized small-signal transistor model; nodal analysis; symbolic circuit analysis; symbolic device stamp; symbolic stamp; symbolic transadmittance; Analytical models; Benchmark testing; Boolean functions; Complexity theory; Data structures; Integrated circuit modeling; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2011 16th Asia and South Pacific
  • Conference_Location
    Yokohama
  • ISSN
    2153-6961
  • Print_ISBN
    978-1-4244-7515-5
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2011.5722183
  • Filename
    5722183