• DocumentCode
    2632640
  • Title

    Circuit design challenges in embedded memory and resistive RAM (RRAM) for mobile SoC and 3D-IC

  • Author

    Chang, Meng-Fan ; Chiu, Pi-Feng ; Sheu, Shyh-Shyuan

  • Author_Institution
    Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2011
  • fDate
    25-28 Jan. 2011
  • Firstpage
    197
  • Lastpage
    203
  • Abstract
    Mobile systems require high-performance and low-power SoC or 3D-IC chips to perform complex operations, ensure a small form-factor and ensure a long battery life time. A low supply voltage (VDD) is frequently utilized to suppress dynamic power consumption, standby current, and thermal effects in SoC and 3D-IC. Furthermore, lowering the VDD reduces the voltage stress of the devices and slows the aging of chips. However, a low VDD for embedded memories can cause functional failure and low yield. This paper reviews various challenges in the design of low-voltage circuits for embedded memory (SRAM and ROM). It also discusses emerging embedded memory solutions. Alternative memory interfaces and architectures for mobile SoC and 3D-IC are also explored.
  • Keywords
    embedded systems; mobile communication; random-access storage; system-on-chip; three-dimensional integrated circuits; 3D-IC chips; ROM; SRAM; circuit design challenges; dynamic power consumption; embedded memories; embedded memory solutions; functional failure; high-performance SoC; long battery life time; low supply voltage; low-power SoC; low-voltage circuits; memory architecture; memory interface; mobile SoC; mobile systems; resistive RAM; standby current; thermal effects; voltage stress; Computer architecture; Microprocessors; Mobile communication; Nonvolatile memory; Power demand; Random access memory; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2011 16th Asia and South Pacific
  • Conference_Location
    Yokohama
  • ISSN
    2153-6961
  • Print_ISBN
    978-1-4244-7515-5
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2011.5722184
  • Filename
    5722184