Title :
Pulsed Laser Assisted Chemical Etch for analytic surface preparation
Author :
Chivas, Robert ; Silverman, Scott ; Dandekar, Niru
Author_Institution :
Varioscale, Inc., San Marcos, CA, USA
Abstract :
Pulsed Laser Assisted Chemical Etching (PLACE) is an advanced method of surface preparation for analytic investigations such as: Focused Ion Beam (FIB) circuit edit, Failure Analysis chemical processes (poly-Si etch), Backside SIMS and Optical techniques such as Photoemission Microscopy. PLACE can achieve ultra-high purity and fine dimensional control since it is a dry process relying on pyrolytic vapor phase reactions initiated, and constrained, by a pulsed laser.
Keywords :
elemental semiconductors; etching; failure analysis; focused ion beam technology; laser beam etching; optical microscopy; silicon; FIB circuit edit; PLACE; Si; analytic surface preparation; backside SIMS; dry process; failure analysis chemical processes; fine dimensional control; focused ion beam; optical techniques; photoemission microscopy; poly-silicon etch; pulsed laser assisted chemical etching; pyrolytic vapor phase reactions; ultra-high purity; Chemical lasers; Etching; Laser beams; Rough surfaces; Silicon; Surface roughness; SIMS; analytic surface prep; backside; chemical; etch; laser; poly-Si;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2012 IEEE International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4577-1678-2
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2012.6241787
