DocumentCode
2633464
Title
HCI vs. BTI? - Neither one´s out
Author
Schlunder, Christian ; Aresu, Stefano ; Georgakos, Georg ; Kanert, W. ; Reisinger, H. ; Hofmann, Klaus ; Gustin, Wolfgang
Author_Institution
Corp. Reliability Dept., Infineon Technol. AG, Neubiberg, Germany
fYear
2012
fDate
15-19 April 2012
Abstract
In the development of MOSFETs first `Hot Carrier Injection´ (HCI) played an important role for reliability aspects [1,2]. With new shrinked process generations and nitrided gate oxides additionally the `Bias Temperature Instability´ (BTI) raised and became the most critical mechanism. Some publications even claim that HCI is negligible in main-stream applications [3-6]. But is this statement generally true or is it the result of a partial view? This paper will discuss the area of conflict regarding the importance of N/PBTI and HCI. Some typical examples will illuminate different fields of applications with one dominating damage mechanism. Specific characteristics of these circuits and operation conditions leading to an outbalance of HCI or Negative-/Positive-BTI will be carved out. Finally it will be evaluated if a general trend is observable.
Keywords
MOSFET; circuit stability; hot carriers; semiconductor device reliability; HCI; MOSFET; N/PBTI; bias temperature instability; hot carrier injection; negative-/positive-BTI; nitrided gate oxides; reliability aspect; shrinked process generation; Degradation; Hot carriers; Human computer interaction; Logic gates; MOSFETs; Reliability; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2012 IEEE International
Conference_Location
Anaheim, CA
ISSN
1541-7026
Print_ISBN
978-1-4577-1678-2
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2012.6241797
Filename
6241797
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