• DocumentCode
    2633852
  • Title

    Fundamental failure mechanisms limiting maximum voltage operation in AlGaN/GaN HEMTs

  • Author

    Hodge, Michael D. ; Vetury, Ramakrishna ; Shealy, Jeffrey B.

  • Author_Institution
    RF Micro Devices, Univ. of North Carolina at Charlotte, Charlotte, NC, USA
  • fYear
    2012
  • fDate
    15-19 April 2012
  • Abstract
    The authors report on the fundamental failure mechanisms limiting maximum applied voltage in AlGaN/GaN HEMTs. Device failure in high voltage off state conditions was studied by controlling drain leakage current and maximum applied drain voltage simultaneously. It was found that failure was associated with loss in gate control of channel current and a permanent degradation of gate diode leakage current. No permanent significant change until device failure was observed in ON-state parameters such as Ron, Idss and Idmax, thus distinguishing this failure mode from the inverse pieozo-electric effect as reported in literature.
  • Keywords
    III-V semiconductors; aluminium compounds; failure analysis; gallium compounds; high electron mobility transistors; integrated circuit reliability; wide band gap semiconductors; AlGaN-GaN; AlGaN/GaN HEMT; ON-state parameter; device failure; drain leakage current control; drain voltage; failure mode; fundamental failure mechanism; gate control; gate diode leakage current; inverse pieozo-electric effect; maximum voltage operation; permanent degradation; Breakdown voltage; Degradation; Electric breakdown; Gallium nitride; Leakage current; Logic gates; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2012 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4577-1678-2
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2012.6241816
  • Filename
    6241816