DocumentCode
2633852
Title
Fundamental failure mechanisms limiting maximum voltage operation in AlGaN/GaN HEMTs
Author
Hodge, Michael D. ; Vetury, Ramakrishna ; Shealy, Jeffrey B.
Author_Institution
RF Micro Devices, Univ. of North Carolina at Charlotte, Charlotte, NC, USA
fYear
2012
fDate
15-19 April 2012
Abstract
The authors report on the fundamental failure mechanisms limiting maximum applied voltage in AlGaN/GaN HEMTs. Device failure in high voltage off state conditions was studied by controlling drain leakage current and maximum applied drain voltage simultaneously. It was found that failure was associated with loss in gate control of channel current and a permanent degradation of gate diode leakage current. No permanent significant change until device failure was observed in ON-state parameters such as Ron, Idss and Idmax, thus distinguishing this failure mode from the inverse pieozo-electric effect as reported in literature.
Keywords
III-V semiconductors; aluminium compounds; failure analysis; gallium compounds; high electron mobility transistors; integrated circuit reliability; wide band gap semiconductors; AlGaN-GaN; AlGaN/GaN HEMT; ON-state parameter; device failure; drain leakage current control; drain voltage; failure mode; fundamental failure mechanism; gate control; gate diode leakage current; inverse pieozo-electric effect; maximum voltage operation; permanent degradation; Breakdown voltage; Degradation; Electric breakdown; Gallium nitride; Leakage current; Logic gates; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2012 IEEE International
Conference_Location
Anaheim, CA
ISSN
1541-7026
Print_ISBN
978-1-4577-1678-2
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2012.6241816
Filename
6241816
Link To Document