The reliability approaches and requirements for IC component in telecom system

Author

Guofujun ; Zhoujiang ; Xieronghua

Author_Institution

Component Reliability Dept., Huawei Tech. Co., Ltd., Shenzhen, China

fYear

2012

fDate

15-19 April 2012

Abstract

Telecom system and its reliability are introduced. Approaches in telecom equipment design and manufacture are summarized, such as IC supplier process management, incoming quality control, failure rate and wear-out lifetime evaluation, equipment process online monitor, reliability burn-in and screening, field failure analysis and improvement and so on. Telecom equipment becomes more complicated and integrated and brings engineering challenges to board design with IC component suffering high electrical, temperature and mechanical stress. Flexible and low cost engineering approaches introduced and requirements for IC industry proposed.

Keywords

failure analysis; integrated circuit design; reliability; IC component; IC industry; IC supplier process management; equipment process online monitor; failure rate; field failure analysis; low cost engineering; mechanical stress; quality control; reliability burn-in; screening; telecom equipment design; telecom system; wear-out lifetime evaluation; Integrated circuit reliability; Integrated circuits; Stress; Telecommunications; Temperature measurement; Temperature sensors; IC component; reliability; telecom;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium (IRPS), 2012 IEEE International

Conference_Location

Anaheim, CA

ISSN

1541-7026

Print_ISBN

978-1-4577-1678-2

Electronic_ISBN

1541-7026

Type

conf

DOI

10.1109/IRPS.2012.6241834

Filename

6241834