Title :
The reliability approaches and requirements for IC component in telecom system
Author :
Guofujun ; Zhoujiang ; Xieronghua
Author_Institution :
Component Reliability Dept., Huawei Tech. Co., Ltd., Shenzhen, China
Abstract :
Telecom system and its reliability are introduced. Approaches in telecom equipment design and manufacture are summarized, such as IC supplier process management, incoming quality control, failure rate and wear-out lifetime evaluation, equipment process online monitor, reliability burn-in and screening, field failure analysis and improvement and so on. Telecom equipment becomes more complicated and integrated and brings engineering challenges to board design with IC component suffering high electrical, temperature and mechanical stress. Flexible and low cost engineering approaches introduced and requirements for IC industry proposed.
Keywords :
failure analysis; integrated circuit design; reliability; IC component; IC industry; IC supplier process management; equipment process online monitor; failure rate; field failure analysis; low cost engineering; mechanical stress; quality control; reliability burn-in; screening; telecom equipment design; telecom system; wear-out lifetime evaluation; Integrated circuit reliability; Integrated circuits; Stress; Telecommunications; Temperature measurement; Temperature sensors; IC component; reliability; telecom;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2012 IEEE International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4577-1678-2
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2012.6241834
