DocumentCode
2635130
Title
Stress analysis of a functional gradient material plate with a circular hole under symmetric loads
Author
Chen, Wen-Tao ; Gao, Cun-Fa ; Yang, Quan-quan
Author_Institution
Coll. of Aerosp. Eng., Nanjing Univ. of Aeronaut. & Astronaut., Nanjing
fYear
2008
fDate
5-8 Dec. 2008
Firstpage
553
Lastpage
556
Abstract
This paper is to study the stress distribution of a functional gradient material plate with a circular hole under symmetric load. With using the method of homogenized layer and neglecting the thermal effects on the structure, the solution for the stress distribution of the functional gradient material plate having radial arbitrary elastic modulus is derived based on the known results of a single thick layer cylinder structure, and the continuous conditions of stress and displacement along the interfaces. When the number of the layer N rarr infin, one can obtain an exact solution. But, since the N is taken as a finite number in general cases, so only an approximate solution can be presented. As an example, a functional gradient material plate with different radial elastic modulus is selected for numerical calculation. It is shown that the stress is greatly reduced as the radial elastic modulus increased, and moreover the stress level varies when the radial elastic modulus increased in different ways. Thus, it can be concluded that the stress around the circular hole in the functional gradient material plate can be effectively reduced by choosing the proper change ways of the radial elastic modulus.
Keywords
elastic moduli; functionally graded materials; plates (structures); stress analysis; circular hole; functional gradient material plate; homogenized layer; radial arbitrary elastic modulus; single thick layer cylinder structure; stress analysis; stress distribution; symmetric load; Aerospace engineering; Aerospace materials; Educational institutions; Engine cylinders; Thermal stresses; Functional gradient material; circular hole; stress analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Piezoelectricity, Acoustic Waves, and Device Applications, 2008. SPAWDA 2008. Symposium on
Conference_Location
Nanjing
Print_ISBN
978-1-4244-2891-5
Type
conf
DOI
10.1109/SPAWDA.2008.4775851
Filename
4775851
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