• DocumentCode
    2635130
  • Title

    Stress analysis of a functional gradient material plate with a circular hole under symmetric loads

  • Author

    Chen, Wen-Tao ; Gao, Cun-Fa ; Yang, Quan-quan

  • Author_Institution
    Coll. of Aerosp. Eng., Nanjing Univ. of Aeronaut. & Astronaut., Nanjing
  • fYear
    2008
  • fDate
    5-8 Dec. 2008
  • Firstpage
    553
  • Lastpage
    556
  • Abstract
    This paper is to study the stress distribution of a functional gradient material plate with a circular hole under symmetric load. With using the method of homogenized layer and neglecting the thermal effects on the structure, the solution for the stress distribution of the functional gradient material plate having radial arbitrary elastic modulus is derived based on the known results of a single thick layer cylinder structure, and the continuous conditions of stress and displacement along the interfaces. When the number of the layer N rarr infin, one can obtain an exact solution. But, since the N is taken as a finite number in general cases, so only an approximate solution can be presented. As an example, a functional gradient material plate with different radial elastic modulus is selected for numerical calculation. It is shown that the stress is greatly reduced as the radial elastic modulus increased, and moreover the stress level varies when the radial elastic modulus increased in different ways. Thus, it can be concluded that the stress around the circular hole in the functional gradient material plate can be effectively reduced by choosing the proper change ways of the radial elastic modulus.
  • Keywords
    elastic moduli; functionally graded materials; plates (structures); stress analysis; circular hole; functional gradient material plate; homogenized layer; radial arbitrary elastic modulus; single thick layer cylinder structure; stress analysis; stress distribution; symmetric load; Aerospace engineering; Aerospace materials; Educational institutions; Engine cylinders; Thermal stresses; Functional gradient material; circular hole; stress analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Piezoelectricity, Acoustic Waves, and Device Applications, 2008. SPAWDA 2008. Symposium on
  • Conference_Location
    Nanjing
  • Print_ISBN
    978-1-4244-2891-5
  • Type

    conf

  • DOI
    10.1109/SPAWDA.2008.4775851
  • Filename
    4775851