Title :
Soft Defect Localization (SDL) applied on analog and mixed-mode ICs failure analysis
Author :
Li, Jinglong ; Wu, Chunlei
Author_Institution :
Product Anal. Lab., Freescale Semicond. (China) Ltd., Tianjin, China
Abstract :
Soft Defect Localization (SDL) has been applied on digital ICs failure analysis. But for analog and mixed-mode ICs, it is not so common. The analog failure types and characters are various, such as pulse width, amplitude, delay time, and so on. It is difficult to detect them directly by SDL system. In this paper, two FA cases are introduced to explain how to perform SDL on analog failures.
Keywords :
failure analysis; mixed analogue-digital integrated circuits; SDL; analog IC; digital IC; failure analysis; mixed-mode IC; soft defect localization; Failure analysis; Heating; Integrated optics; Lasers; Metals; Oscilloscopes; Temperature sensors; Failure Analysis; Soft Defect Localization; self-heating “pass/fail” flag;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2012 IEEE International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4577-1678-2
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2012.6241907