DocumentCode
2636068
Title
Challenges in optoelectronic component packaging for next generation pluggable modules
Author
Bond, Aaron ; Wolf, Robert ; Stackhouse, Duane ; Sipics, Michael ; Zhang, Jiaming ; Jambunathan, Ram
Author_Institution
Apogee Photonics, Inc., Allentown, PA
fYear
2005
fDate
22-22 Oct. 2005
Firstpage
722
Lastpage
723
Abstract
A review of trends in optoelectronic packaging at the component and module level is presented. The trends towards smaller form factor, and lower power dissipation is discussed and the results of a cooled micro TOSA is described. The importance of micro cooler technology and micro optics to the overall technical solution is discussed, along with the application of this technology to higher functionality transmitters
Keywords
electronics packaging; micro-optics; modules; optical transmitters; optoelectronic devices; cooled micro TOSA; form factor; microoptics; optoelectronic component packaging; pluggable modules; power dissipation; transmitters; Costs; Manufacturing; Optical transmitters; Packaging; Power dissipation; Power lasers; Strain measurement; Temperature; Transceivers; Wavelength division multiplexing;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society, 2005. LEOS 2005. The 18th Annual Meeting of the IEEE
Conference_Location
Sydney, NSW
Print_ISBN
0-7803-9217-5
Type
conf
DOI
10.1109/LEOS.2005.1548202
Filename
1548202
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