Title :
Power integrity considerations for CPU EMI-reducing interconnect design
Author :
Hockanson, David M.
Author_Institution :
Sun Microsystems, Inc.
Keywords :
Design engineering; Electromagnetic compatibility; Frequency; Inductance; Integrated circuit interconnections; Packaging; Pins; Power harmonic filters; Sun; USA Councils;
Conference_Titel :
Electromagnetic Compatibility, 2006. EMC 2006. 2006 IEEE International Symposium on
Conference_Location :
Portland, OR, USA
Print_ISBN :
1-4244-0293-X
DOI :
10.1109/ISEMC.2006.1706414
