DocumentCode
2636839
Title
Thermal-Aware Test Scheduling for Core-Based SoC in an Abort-on-First-Fail Test Environment
Author
He, Zhiyuan ; Peng, Zebo ; Eles, Petru
Author_Institution
Dept. of Comput. & Inf. Sci., Linkoping Univ., Linkoping, Sweden
fYear
2009
fDate
27-29 Aug. 2009
Firstpage
239
Lastpage
246
Abstract
Long test application time and high temperature have become two major issues of system-on-chip (SoC) test. In order to minimize test application times and avoid overheating during tests, we propose a thermal-aware test scheduling technique for core-based SoC in an abort-on-first-fail (AOFF) test environment. The AOFF environment assumes that the test process is terminated as soon as the first fault is detected, which is usually deployed in volume production test. To avoid high temperature, test sets are partitioned into test sub-sequences which are separated by cooling periods. The proposed test scheduling technique utilizes instantaneous thermal simulation results to guide the partitioning of test sets and to determine the lengths of cooling periods. Experimental results have shown that the proposed technique is efficient to minimize the expected test application time while keeping the temperatures of cores under test below the imposed temperature limit.
Keywords
cooling; integrated circuit testing; system-on-chip; abort-on-first-fail test environment; cooling periods; core-based SoC; test subsequence set; thermal-aware test scheduling; volume production test; Circuit testing; Cooling; Electronic equipment testing; Electronic packaging thermal management; Integrated circuit testing; Production; Scheduling; System testing; System-on-a-chip; Temperature; abort-on-first-fail; system-on-chip test; test scheduling; thermal-aware test;
fLanguage
English
Publisher
ieee
Conference_Titel
Digital System Design, Architectures, Methods and Tools, 2009. DSD '09. 12th Euromicro Conference on
Conference_Location
Patras
Print_ISBN
978-0-7695-3782-5
Type
conf
DOI
10.1109/DSD.2009.136
Filename
5350154
Link To Document