DocumentCode :
2636839
Title :
Thermal-Aware Test Scheduling for Core-Based SoC in an Abort-on-First-Fail Test Environment
Author :
He, Zhiyuan ; Peng, Zebo ; Eles, Petru
Author_Institution :
Dept. of Comput. & Inf. Sci., Linkoping Univ., Linkoping, Sweden
fYear :
2009
fDate :
27-29 Aug. 2009
Firstpage :
239
Lastpage :
246
Abstract :
Long test application time and high temperature have become two major issues of system-on-chip (SoC) test. In order to minimize test application times and avoid overheating during tests, we propose a thermal-aware test scheduling technique for core-based SoC in an abort-on-first-fail (AOFF) test environment. The AOFF environment assumes that the test process is terminated as soon as the first fault is detected, which is usually deployed in volume production test. To avoid high temperature, test sets are partitioned into test sub-sequences which are separated by cooling periods. The proposed test scheduling technique utilizes instantaneous thermal simulation results to guide the partitioning of test sets and to determine the lengths of cooling periods. Experimental results have shown that the proposed technique is efficient to minimize the expected test application time while keeping the temperatures of cores under test below the imposed temperature limit.
Keywords :
cooling; integrated circuit testing; system-on-chip; abort-on-first-fail test environment; cooling periods; core-based SoC; test subsequence set; thermal-aware test scheduling; volume production test; Circuit testing; Cooling; Electronic equipment testing; Electronic packaging thermal management; Integrated circuit testing; Production; Scheduling; System testing; System-on-a-chip; Temperature; abort-on-first-fail; system-on-chip test; test scheduling; thermal-aware test;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Digital System Design, Architectures, Methods and Tools, 2009. DSD '09. 12th Euromicro Conference on
Conference_Location :
Patras
Print_ISBN :
978-0-7695-3782-5
Type :
conf
DOI :
10.1109/DSD.2009.136
Filename :
5350154
Link To Document :
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