• DocumentCode
    2637341
  • Title

    Silicon carbide devices and processes - present status and future pers

  • Author

    Ostling, M. ; Lee, H.-S. ; Domeij, M. ; Zetterling, C.-M.

  • Author_Institution
    R. Inst. of Technol., Stockholm
  • fYear
    2006
  • fDate
    22-24 June 2006
  • Firstpage
    34
  • Lastpage
    42
  • Abstract
    Silicon carbide electronic devices are already commercially available in a few application areas such as high voltage rectifiers and emerging RF power amplifiers. Over the past 15 years a very rapid progress of both materials and device quality has been seen and is very encouraging for the near future application market. Prototype devices show amazing improvement each year in all device categories as well as a markedly improved wafer quality. However, materials defect issues are still limiting economically viable production of large area devices with high yield. In this paper a thorough review of progress in SiC device process technology and presents the state-of-the art SiC devices as well as new application areas such as ferroelectric field effect transistors
  • Keywords
    power semiconductor devices; semiconductor device manufacture; silicon compounds; wide band gap semiconductors; JFET; Schottky diode; SiC; bipolar transistor; device process technology; electronic devices; ferroelectric field effect transistors; materials defect; power devices; silicon carbide devices; Consumer electronics; Ferroelectric materials; High power amplifiers; Power generation economics; Prototypes; Radio frequency; Radiofrequency amplifiers; Rectifiers; Silicon carbide; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mixed Design of Integrated Circuits and System, 2006. MIXDES 2006. Proceedings of the International Conference
  • Conference_Location
    Gdynia
  • Print_ISBN
    83-922632-2-7
  • Type

    conf

  • DOI
    10.1109/MIXDES.2006.1706532
  • Filename
    1706532