Title :
The research on release micromanipulation mechanism and method of microparticle based on dynamic adhesion control
Author :
Bing, Shao ; Tao, Chen
Author_Institution :
State Key Lab. of Robot. & Syst., Harbin Inst. of Technol., Harbin, China
Abstract :
The manipulation of particles at the micro-scale is of great importance and challenge in the fields of electronics and bioengineering. A compound vibration adhesion control technique has been proposed in this article in order to achieve the manipulation of mciro spheres. This paper firstly analyzes the micro-scale adhesive force generated during the release process. Then a dynamic adhesive contact model was established. Based on this model, a novel microgripper has been developed. Its performances such as the micromanipulation acceleration, inertial force, and adhesion force for the release manipulation are investigated by dynamics modeling and simulation. Precision positioning problem of the released micro-scale object is analysed. Experiments are conducted under different size of microparticles, to verify the performance the novel microgripper, such as effective release and accurate positioning. The results have confirmed that microgripper by the use of the compound vibration adhesion control technique can achieve an effective and reliable release manipulation of microparticles. This novel microgripper has the advantages of the high release repeatibility and accuracy.
Keywords :
adhesion; grippers; inertial systems; micromanipulators; precision engineering; vibration control; adhesion force; bioengineering; compound vibration adhesion control; dynamic adhesion control; dynamic adhesive contact model; dynamics modeling; electronics; inertial force; mcirosphere manipulation; microgripper; micromanipulation acceleration; micromanipulation mechanism; microparticle; microscale adhesive force; microscale object; precision positioning problem; Acceleration; Adhesives; Compounds; Dynamics; Force; Grippers; Vibrations; dynamic adhesion control; microgripper; micromanipulation; release;
Conference_Titel :
Industrial Electronics and Applications (ICIEA), 2011 6th IEEE Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-8754-7
Electronic_ISBN :
pending
DOI :
10.1109/ICIEA.2011.5975868