Title :
Low-Frequency Noise Sources in Advanced UTBB FD-SOI MOSFETs
Author :
Theodorou, C.G. ; Ioannidis, E.G. ; Andrieu, F. ; Poiroux, T. ; Faynot, O. ; Dimitriadis, C.A. ; Ghibaudo, Gerard
Author_Institution :
Dept. of Phys., Aristotle Univ. of Thessaloniki, Thessaloniki, Greece
Abstract :
The low-frequency noise (LFN) sources in ultrathin body (8.7 nm) and buried oxide (10 nm) fully depleted silicon-on-insulator (UTBB FD-SOI) n- and p-channel MOSFETs are analyzed. Both flicker and Lorentzian-type noise were observed, showing a dependence on the channel dimensions and the front/back gate bias conditions. The flicker noise component can be described by the carrier number with correlated mobility fluctuations model considering contribution from both interfaces. The Lorentzian-type noise originates mainly from generation-recombination (g-r) traps in the Si film, uniformly distributed in thin layers next to the drain and source contacts, and in some cases from g-r traps located at the front Si/oxide interface. No different noise behavior was observed between n- and p-channel devices operating in front-gate mode. Finally, LFN comparison between FD-SOI devices of different technologies is presented for the first time, demonstrating the impact of the UTBB technology on the LFN properties.
Keywords :
MOSFET; elemental semiconductors; flicker noise; semiconductor device models; semiconductor device noise; silicon; silicon-on-insulator; Lorentzian-type noise; Si; advanced UTBB FD-SOI MOSFET; correlated mobility fluctuations model; flicker noise; front gate mode; g-r traps; generation-recombination traps; low-frequency noise sources; size 10 nm; size 8.7 nm; ultrathin body buried oxide fully depleted silicon-on-insulator MOSFET; Dielectrics; Geometry; Logic gates; MOSFET; Noise; Noise measurement; Silicon; Generation-recombination (g-r) noise; low-frequency noise (LFN); ultrathin body and buried oxide fully depleted silicon-on-insulator (UTBB FDSOI MOSFETs);
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2014.2307201