• DocumentCode
    2638787
  • Title

    Hardware acceleration for rapid prototyping of communication system

  • Author

    Gavrincea, Ciprian ; Bas, Joan

  • Author_Institution
    Centre Tecnol. de Telecomunicacions de Catalunya (CTTC), Barcelona, Spain
  • fYear
    2011
  • fDate
    20-23 Oct. 2011
  • Firstpage
    29
  • Lastpage
    34
  • Abstract
    Future mobile communication systems incorporate more sophisticated functionalities which improve their performance and increase their complexity. In order to reduce their time to market figure, the simulation time of the prototyping phase has to be improved. This paper presents a solution for improving the prototyping time by using hardware acceleration by means of reconfigurable field programmable gate arrays (FPGA). In this way, it is possible to take advantage of re-programmability and parallel processing features backed up by the hardware in the loop functionality offered through the Matlab environment. As a case of study it has been implemented the encoding and decoding stages of a convolutional Forward Error Correction (FEC) module. The results presented on this paper demonstrates that hardware acceleration based on reconfigurable FPGA helps to reduce the prototyping time by reducing the simulation time needed to validate the behavior of the module under noisy conditions.
  • Keywords
    convolutional codes; decoding; field programmable gate arrays; forward error correction; FPGA; Matlab environment; communication system; convolutional FEC module; convolutional forward error correction module; decoding stages; encoding stages; hardware acceleration; mobile communication systems; parallel processing; rapid prototyping; reconfigurable field programmable gate arrays; Convolution; Convolutional codes; Decoding; Field programmable gate arrays; Hardware; Polynomials; Viterbi algorithm; FPGA; Viterbi decoder; convolutional encoder; forward error correcation; hardware acceleration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for
  • Conference_Location
    Timisoara
  • Print_ISBN
    978-1-4577-1276-0
  • Electronic_ISBN
    978-1-4577-1275-3
  • Type

    conf

  • DOI
    10.1109/SIITME.2011.6102679
  • Filename
    6102679