DocumentCode
2638852
Title
Design of controlled slew rate CMOS output driver and optimum package-pin placement to minimize the "effective" power/ground switching noise
Author
Senthinathan, R. ; Prince, J.L.
Author_Institution
Center for Electrical Packaging Research, department of Electrical and Computer Engineering, University of Arizona, Tucson, AZ 85721
fYear
1992
fDate
22-24 Apr 1992
Firstpage
15
Lastpage
18
Keywords
Bonding; Circuit noise; Driver circuits; Electronics packaging; Frequency; Noise reduction; Space vector pulse width modulation; Switches; Variable structure systems; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1992
Print_ISBN
0-7803-0683-X
Type
conf
DOI
10.1109/EPEP.1992.572252
Filename
572252
Link To Document