• DocumentCode
    2638853
  • Title

    Data Matrix Code — A reliable optical identification of microelectronic components

  • Author

    Dita, Ion-Cosmin ; Otesteanu, Marius ; Quint, Franz

  • Author_Institution
    Fac. of Electron. & Telecommun., Politeh. Univ. of Timisoara, Timisoara, Romania
  • fYear
    2011
  • fDate
    20-23 Oct. 2011
  • Firstpage
    39
  • Lastpage
    44
  • Abstract
    In automatic manufacturing and assembling of printed circuit boards (PCB) one needs to reliably identify the microelectronic components. To achieve this, we propose a method for identification of electronic and microelectronic components by marking each component with a Data Matrix Code (DMC). Using this code, the checking system can recognize the position of each component and by decoding, it can extract information about the type and the manufacturing of the microelectronic component. Because of the very small sizes of the components, because of in general critical illumination conditions and because of the low reflexivity of the black plastic packages of the components, the image processing task of finding the code and extracting the information is much more challenging than in the case of standard DMC printed with black ink on white paper. To cope with this situation we propose a new robust method for Data Matrix Code identification.
  • Keywords
    decoding; integrated circuit manufacture; printed circuit manufacture; DMC; PCB; automatic manufacturing; black plastic packages; data matrix code identification; decoding; electronic identification; illumination conditions; image processing task; information extraction; microelectronic component manufacturing; printed circuit boards; reliable optical identification; Electronics packaging; Microelectronics; Pattern recognition; Reliability; Timing; Transmission line matrix methods; Vectors; 2D barcodes; Data Matrix Code recognition; Microelectronic components; Reliable Optical Identification;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for
  • Conference_Location
    Timisoara
  • Print_ISBN
    978-1-4577-1276-0
  • Electronic_ISBN
    978-1-4577-1275-3
  • Type

    conf

  • DOI
    10.1109/SIITME.2011.6102683
  • Filename
    6102683