DocumentCode
2638863
Title
Non-fourier Thermal Conduction In Nano-scaled Electronic Structures
Author
Vermeersch, B. ; De Mey, G.
Author_Institution
Ghent Univ.
fYear
2006
fDate
22-24 June 2006
Firstpage
431
Lastpage
436
Abstract
When very fast phenomena and small structure dimensions are involved, the classical law of Fourier becomes inaccurate. A more sophisticated model is then needed to describe the thermal conduction mechanisms in a physically acceptable way. In this paper the according diffusion equation is solved for a nano-scaled semiconductor substrate, in order to gain physical insight in the problem. Analytical solutions for the temperature and heat flux distributions are presented. The complex thermal impedance and thermal step response of the structure are discussed. The most remarkable fact is that the temperature inside the substrate can go below the ambient temperature for a short amount of time. The results also clearly demonstrate the wave character of the heat propagation and the analogy with RLC transmission lines
Keywords
RLC circuits; heat conduction; hyperbolic equations; nanoelectronics; transmission lines; RLC transmission lines; ambient temperature; heat flux distributions; heat propagation; hyperbolic diffusion equation; nanoscale electronic structures; nanoscale heat transfer; non-Fourier thermal conduction; thermal impedance; thermal step response; thermal waves; Conducting materials; Equations; Heat transfer; Impedance; Nanostructures; Substrates; Temperature distribution; Thermal conductivity; Transmission lines; Vibrations;
fLanguage
English
Publisher
ieee
Conference_Titel
Mixed Design of Integrated Circuits and System, 2006. MIXDES 2006. Proceedings of the International Conference
Conference_Location
Gdynia
Print_ISBN
83-922632-2-7
Type
conf
DOI
10.1109/MIXDES.2006.1706615
Filename
1706615
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