• DocumentCode
    2638863
  • Title

    Non-fourier Thermal Conduction In Nano-scaled Electronic Structures

  • Author

    Vermeersch, B. ; De Mey, G.

  • Author_Institution
    Ghent Univ.
  • fYear
    2006
  • fDate
    22-24 June 2006
  • Firstpage
    431
  • Lastpage
    436
  • Abstract
    When very fast phenomena and small structure dimensions are involved, the classical law of Fourier becomes inaccurate. A more sophisticated model is then needed to describe the thermal conduction mechanisms in a physically acceptable way. In this paper the according diffusion equation is solved for a nano-scaled semiconductor substrate, in order to gain physical insight in the problem. Analytical solutions for the temperature and heat flux distributions are presented. The complex thermal impedance and thermal step response of the structure are discussed. The most remarkable fact is that the temperature inside the substrate can go below the ambient temperature for a short amount of time. The results also clearly demonstrate the wave character of the heat propagation and the analogy with RLC transmission lines
  • Keywords
    RLC circuits; heat conduction; hyperbolic equations; nanoelectronics; transmission lines; RLC transmission lines; ambient temperature; heat flux distributions; heat propagation; hyperbolic diffusion equation; nanoscale electronic structures; nanoscale heat transfer; non-Fourier thermal conduction; thermal impedance; thermal step response; thermal waves; Conducting materials; Equations; Heat transfer; Impedance; Nanostructures; Substrates; Temperature distribution; Thermal conductivity; Transmission lines; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mixed Design of Integrated Circuits and System, 2006. MIXDES 2006. Proceedings of the International Conference
  • Conference_Location
    Gdynia
  • Print_ISBN
    83-922632-2-7
  • Type

    conf

  • DOI
    10.1109/MIXDES.2006.1706615
  • Filename
    1706615