Optimizing laser soldering of SMD components: From theory to practice

The paper presents the results of a study of the procedure of laser soldering chip SMD components, taking into consideration various parameters of the soldering process: type and quantity of solder paste used, energy pumped into the system, etc. There are many situations in modern electronics where the heat for soldering must be controlled very accurately, for example for soldering temperature sensitive components or using different substrates that require a soldering temperature different than the usual ones (PMMA substrates need low temperature soldering). We studied the energy necessary for realizing high quality solder joints even from the first soldering, thus reducing the number of destroyed samples and decreasing the time and costs of development of the electronic module. Based on the theoretical model, we soldered components and performed electrical and mechanical tests, cross-sections, optical and X-ray inspections.