DocumentCode
2638901
Title
Resistance and non-linearity of electrically conductive adhesives aged by thermal, humidity and combined aging
Author
Barto, Seba ; Mach, Pavel
Author_Institution
Dept. of Electrotechnol., Czech Tech. Univ. in Prague, Prague, Czech Republic
fYear
2011
fDate
20-23 Oct. 2011
Firstpage
59
Lastpage
62
Abstract
Adhesive joints formed of two types of electrically conductive adhesives have been aged at the higher temperature, higher humidity and a combination of the higher temperature/higher humidity. Correlations between these different types of aging have been calculated for joints resistances and joints nonlinearities. It has been found that correlations are high in the case of ECA #1 and low for ECA #2. In research field, aging is applied to test the expected reactions of the most important material parameters of electrically conductive adhesives. It also helps identifying the total operating life of the tested components.
Keywords
ageing; conductive adhesives; electrical resistivity; adhesive joints; electrically conductive adhesives; humidity aging; joint nonlinearity; joint resistance; thermal aging; Aging; Conductive adhesives; Correlation; Humidity; Joints; Materials; Resistance; Adhesives; Aging; Correlation; Non-linearity; Resistivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for
Conference_Location
Timisoara
Print_ISBN
978-1-4577-1276-0
Electronic_ISBN
978-1-4577-1275-3
Type
conf
DOI
10.1109/SIITME.2011.6102686
Filename
6102686
Link To Document