Title :
Resistance and non-linearity of electrically conductive adhesives aged by thermal, humidity and combined aging
Author :
Barto, Seba ; Mach, Pavel
Author_Institution :
Dept. of Electrotechnol., Czech Tech. Univ. in Prague, Prague, Czech Republic
Abstract :
Adhesive joints formed of two types of electrically conductive adhesives have been aged at the higher temperature, higher humidity and a combination of the higher temperature/higher humidity. Correlations between these different types of aging have been calculated for joints resistances and joints nonlinearities. It has been found that correlations are high in the case of ECA #1 and low for ECA #2. In research field, aging is applied to test the expected reactions of the most important material parameters of electrically conductive adhesives. It also helps identifying the total operating life of the tested components.
Keywords :
ageing; conductive adhesives; electrical resistivity; adhesive joints; electrically conductive adhesives; humidity aging; joint nonlinearity; joint resistance; thermal aging; Aging; Conductive adhesives; Correlation; Humidity; Joints; Materials; Resistance; Adhesives; Aging; Correlation; Non-linearity; Resistivity;
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for
Conference_Location :
Timisoara
Print_ISBN :
978-1-4577-1276-0
Electronic_ISBN :
978-1-4577-1275-3
DOI :
10.1109/SIITME.2011.6102686