• DocumentCode
    2638901
  • Title

    Resistance and non-linearity of electrically conductive adhesives aged by thermal, humidity and combined aging

  • Author

    Barto, Seba ; Mach, Pavel

  • Author_Institution
    Dept. of Electrotechnol., Czech Tech. Univ. in Prague, Prague, Czech Republic
  • fYear
    2011
  • fDate
    20-23 Oct. 2011
  • Firstpage
    59
  • Lastpage
    62
  • Abstract
    Adhesive joints formed of two types of electrically conductive adhesives have been aged at the higher temperature, higher humidity and a combination of the higher temperature/higher humidity. Correlations between these different types of aging have been calculated for joints resistances and joints nonlinearities. It has been found that correlations are high in the case of ECA #1 and low for ECA #2. In research field, aging is applied to test the expected reactions of the most important material parameters of electrically conductive adhesives. It also helps identifying the total operating life of the tested components.
  • Keywords
    ageing; conductive adhesives; electrical resistivity; adhesive joints; electrically conductive adhesives; humidity aging; joint nonlinearity; joint resistance; thermal aging; Aging; Conductive adhesives; Correlation; Humidity; Joints; Materials; Resistance; Adhesives; Aging; Correlation; Non-linearity; Resistivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for
  • Conference_Location
    Timisoara
  • Print_ISBN
    978-1-4577-1276-0
  • Electronic_ISBN
    978-1-4577-1275-3
  • Type

    conf

  • DOI
    10.1109/SIITME.2011.6102686
  • Filename
    6102686